surface mount polymer esd suppressors revision november 08, 2013 1 / 4 @socay electronics co., ltd. 2013 specifications are subject to change without notice. please refer to www.socay.com for current information. ESD0201E002N00 socay electronics co., ltd. www.socay.com this specification is applied to electrostatic discharge (esd) protection. it is designed to protect the rf switch ic against esd transients. it has very low capacitance and fast turn on times makes it ideal for the antenna circuit with rf wave (without dc bias). the unique design enables this device to meet the rigorous testing criteria of the iec61000-4-2 standards. u rohs compliant, lead-free and available halogen-free u protection against esd voltages and currents (iec 61000-4-2 level 4) u extremely quick response time (<1 ns) present ideal esd protection u extremely low capacitance (0.2pf typical) u extremely low leakage current u bi-directional device u surface mount device u zero signal distortion symbol unit min typical max. trigger voltage v t v 140 180 clamping voltage v c v 35 50 capacitance, @1mhz c p pf 0.2 0.5 response time ns 1 esd voltage capability, contact discharge mode kv 8 esd voltage capability, air discharge mode kv 15 esd pulse withstand pulses 1000 v t - measurement by using transmission line pulse (tlp) v c - measurement by using transmission line pulse (tlp) c p - device capacitance measured with 1vrms ele ctrical characteristics description features equivalent circuits
surface mount polymer esd suppressors revision november 08, 2013 2 / 4 @socay electronics co., ltd. 2013 specifications are subject to change without notice. please refer to www.socay.com for current information. ESD0201E002N00 socay electronics co., ltd. www.socay.com (1) series type: esd guard tm series (2) chip size (eia): 0201 (3) series type: emi / esd protection (4) capacitance: value - exxx, e002=0.2pf (5) capacitance tolerance: n - 30%, m - 20% (6) rated voltage, vdc substrate ceramic (alumina) symbol spec. encapsulate polymer l 0.63 0.05 end termination ag / ni / sn w 0.30 0.03 h 0.24 0.03 b 0.165 0.05 a 0.35 0.05 c 0.35 0.05 d 0.35 0.05 e xplanation of part number construction & dimensions unit: mm recommended pad outline esd 0 2 0 1 e 002 n 0 0 (1) (2) (3) (4) (5) (6)
surface mount polymer esd suppressors revision november 08, 2013 3 / 4 @socay electronics co., ltd. 2013 specifications are subject to change without notice. please refer to www.socay.com for current information. ESD0201E002N00 socay electronics co., ltd. www.socay.com parameter value unit operating temperature -55 to +125 c storage temperature --55 to +125 c taping package storage condition storage temperature 5 to 40 c relative humidity <65 %rh storage time 12 max month reflow condition pb free assembly pre heat -temperature min (t s(min) ) +150 c -temperature max (t s(max) ) +200 c -time (min to max) (t s ) 60 -180 seconds average ramp up rate ( liquidus temp t l ) to peak 3 c/second max t s(max) to t l - ramp-up rate 3 c/second max reflow - temperature (t l ) (liquidus) +217 c - time (min to max) (t l ) 60 -150 seconds note that this product will be easily damaged by rapid heating, rapid cooling or local heating. do not give heat shock over 100 c in the process of soldering. we recommend to take preheating and gradual cooling soldering gun procedure note the follows, in case of using solder gun for replacement. 1) the tip temperature must be less than 280 for the period within 3 seconds by using soldering gun under 30w 2) the soldering gun tip shall not touch this product directly. soldering volume note that excess of soldering volume will easily get crack the body of this product. peak temperature (t p ) 260 +0/-5 c time within 5 c of actual peak temperature (t p ) 20-40 seconds ramp-down rate 6 c/second max time 25 c to peak temperature (t p ) 8 minutes max temperature specificat ions soldering parameters precaution for soldering precaution for soldering ramp-down preheat critical zone t l to t p time to peak temperature (t 25 to peak) t p t l t s(max) t s(min) 25 temperature ramp-up time
surface mount polymer esd suppressors revision november 08, 2013 4 / 4 @socay electronics co., ltd. 2013 specifications are subject to change without notice. please refer to www.socay.com for current information. ESD0201E002N00 socay electronics co., ltd. www.socay.com carrier tape dimensions unit: mm symbol spec. a 8.00 0.30 b 3.50 0.05 c 1.75 0.10 d 2.00 0.05 e 4.00 0.10 f 1.50 0.10 l 0.71 0.02 packaging method - products shall be heat-sealed in the chip pocket, spacing pitch 2-mm of paper carrier tape with cover tape, and carrier tape shall be reeled to the reel. - tape material to be paper. - cover tape adhesion to be 40 15 grams. w 0.39 0.03 t 0.42 0.03 taping reel dimensions unit: mm taping specifications there shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the heat of taping. quantity of products in the taping package standard quantity 15000pcs / reel shipping quantity is a multiple of standard quantity packaging information
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